Advanced millimeter-wave technologies : antennas, packaging and circuits /

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Bibliographic Details
Imprint:[Hoboken, NJ] : John Wiley, c2009.
Description:1 online resource.
Language:English
Subject:
Format: E-Resource Book
URL for this record:http://pi.lib.uchicago.edu/1001/cat/bib/9905584
Hidden Bibliographic Details
Other authors / contributors:Liu, Duixian.
ISBN:047074295X (electronic bk.)
9780470742952 (electronic bk.)
9780470996171
047099617X
Notes:Includes bibliographical references and index.
Description based on print version record.
Other form:Original 9780470996171 047099617X
Description
Summary:This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging Contains a good number of case studies to aid understanding Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging
Physical Description:1 online resource.
Bibliography:Includes bibliographical references and index.
ISBN:047074295X (electronic bk.)
9780470742952 (electronic bk.)
9780470996171
047099617X