Solder joint reliability prediction for multiple environments /

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Bibliographic Details
Author / Creator:	Perkins, Andrew Eugene.
Imprint:	New York ; London : Springer, 2008.
Description:	1 online resource (xv, 192 p.) : ill.
Language:	English
Subject:	Electronic apparatus and appliances -- Reliability. Solder and soldering. Joints (Engineering) -- Reliability. Electronic apparatus and appliances -- Reliability. Solder and soldering.
Format:	E-Resource Book
URL for this record:	http://pi.lib.uchicago.edu/1001/cat/bib/8892342

Hidden Bibliographic Details
Other authors / contributors:	Sitaraman, Suresh.
ISBN:	9780387793948 (electronic bk.) 0387793941 (electronic bk.)
Notes:	Description based on print version record.
Other form:	Print version: Perkins, Andrew Eugene. Solder joint reliability prediction for multiple environments. New York ; London : Springer, 2008 9780387793931 0387793933

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