Solder joint technology : materials, properties, and reliability /

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Bibliographic Details
Author / Creator:	Tu, K. N. (King-Ning), 1937-
Imprint:	New York : Springer, c2007.
Description:	1 online resource (xvi, 368 p.) : ill.
Language:	English
Series:	Springer series in materials science ; 92 Springer series in materials science ; 92.
Subject:	Welded joints. Welded joints -- Reliability. Solder and soldering. Metals -- Weldability. Metals -- Weldability. Solder and soldering. Welded joints.
Format:	E-Resource Book
URL for this record:	http://pi.lib.uchicago.edu/1001/cat/bib/8882624

Hidden Bibliographic Details
ISBN:	9780387388922 0387388923 9780387388908 (hbk.) 0387388907 (hbk.) 9786610957675 6610957673
Notes:	Includes bibliographical references and index. Description based on print version record.
Summary:	"Critical demands are placed on solder joint technology in flip chip and other high density packaging for advanced electronic consumer products. This book describes the fundamentals of the copper-tin reaction and electromigration that underlie these reliability problems, and the potential for improving solder performance without the use of lead."--Jacket.
Other form:	Print version: Tu, K.N. (King-ning), 1937- Solder joint technology. New York : Springer, c2007 9780387388908 0387388907

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