Solder joint technology : materials, properties, and reliability /
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| Author / Creator: | Tu, K. N. (King-Ning), 1937- |
|---|---|
| Imprint: | New York : Springer, c2007. |
| Description: | 1 online resource (xvi, 368 p.) : ill. |
| Language: | English |
| Series: | Springer series in materials science ; 92 Springer series in materials science ; 92. |
| Subject: | |
| Format: | E-Resource Book |
| URL for this record: | http://pi.lib.uchicago.edu/1001/cat/bib/8882624 |
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| 100 | 1 | |a Tu, K. N. |q (King-Ning), |d 1937- |0 http://id.loc.gov/authorities/names/n77015055 |1 http://viaf.org/viaf/94861065 | |
| 245 | 1 | 0 | |a Solder joint technology : |b materials, properties, and reliability / |c King-Ning Tu. |
| 260 | |a New York : |b Springer, |c c2007. | ||
| 300 | |a 1 online resource (xvi, 368 p.) : |b ill. | ||
| 336 | |a text |b txt |2 rdacontent |0 http://id.loc.gov/vocabulary/contentTypes/txt | ||
| 337 | |a computer |b c |2 rdamedia |0 http://id.loc.gov/vocabulary/mediaTypes/c | ||
| 338 | |a online resource |b cr |2 rdacarrier |0 http://id.loc.gov/vocabulary/carriers/cr | ||
| 490 | 1 | |a Springer series in materials science ; |v 92 | |
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | |a Introduction -- Copper-tin reactions in bulk samples -- Copper-tin reactions in thin-film samples -- Copper-tin reactions in flip chip solder joints -- Kinetic analysis of flux-driven ripening of copper-tin scallops -- Spontaneous tin whisker growth : mechanism and prevention -- Solder reactions on nickel, palladium, and gold -- Fundamentals of electromigration -- Electromigration in in flip chip solder joints -- Polarity effect of electromigration on solder reactions -- ductile-to-brittle transition of solder joints affected by copper-tin reaction and electromigration -- Thermomigration. | |
| 520 | 1 | |a "Critical demands are placed on solder joint technology in flip chip and other high density packaging for advanced electronic consumer products. This book describes the fundamentals of the copper-tin reaction and electromigration that underlie these reliability problems, and the potential for improving solder performance without the use of lead."--Jacket. | |
| 588 | |a Description based on print version record. | ||
| 650 | 0 | |a Welded joints. |0 http://id.loc.gov/authorities/subjects/sh85146001 | |
| 650 | 0 | |a Welded joints |x Reliability. | |
| 650 | 0 | |a Solder and soldering. |0 http://id.loc.gov/authorities/subjects/sh85124553 | |
| 650 | 0 | |a Metals |x Weldability. |0 http://id.loc.gov/authorities/subjects/sh85084257 | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Technical & Manufacturing Industries & Trades. |2 bisacsh | |
| 655 | 4 | |a Electronic books. | |
| 650 | 7 | |a Metals |x Weldability. |2 fast |0 http://id.worldcat.org/fast/fst01018229 | |
| 650 | 7 | |a Solder and soldering. |2 fast |0 http://id.worldcat.org/fast/fst01125221 | |
| 650 | 7 | |a Welded joints. |2 fast |0 http://id.worldcat.org/fast/fst01173540 | |
| 776 | 0 | 8 | |i Print version: |a Tu, K.N. (King-ning), 1937- |t Solder joint technology. |d New York : Springer, c2007 |z 9780387388908 |z 0387388907 |w (DLC) 2007921097 |w (OCoLC)123113661 |
| 830 | 0 | |a Springer series in materials science ; |v 92. | |
| 856 | 4 | 0 | |u http://dx.doi.org/10.1007/978-0-387-38892-2 |y SpringerLink |
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| 035 | |a (ICU)8882624 | ||
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| 928 | |t Library of Congress classification |a TA492.W4 T8 2007eb |l Online |c UC-FullText |u http://dx.doi.org/10.1007/978-0-387-38892-2 |z SpringerLink |g ebooks |i 11451850 | ||