Solder joint technology : materials, properties, and reliability /

"Critical demands are placed on solder joint technology in flip chip and other high density packaging for advanced electronic consumer products. This book describes the fundamentals of the copper-tin reaction and electromigration that underlie these reliability problems, and the potential for i...

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Bibliographic Details
Author / Creator:Tu, K. N. (King-Ning), 1937-
Imprint:New York : Springer, c2007.
Description:1 online resource (xvi, 368 p.) : ill.
Language:English
Series:Springer series in materials science ; 92
Springer series in materials science ; 92.
Subject:Welded joints.
Welded joints -- Reliability.
Solder and soldering.
Metals -- Weldability.
TECHNOLOGY & ENGINEERING -- Technical & Manufacturing Industries & Trades.
Metals -- Weldability.
Solder and soldering.
Welded joints.
Electronic books.
Format: E-Resource Book
URL for this record:http://pi.lib.uchicago.edu/1001/cat/bib/8882624
Hidden Bibliographic Details
ISBN:9780387388922
0387388923
9780387388908 (hbk.)
0387388907 (hbk.)
9786610957675
6610957673
Notes:Includes bibliographical references and index.
Description based on print version record.
Summary:"Critical demands are placed on solder joint technology in flip chip and other high density packaging for advanced electronic consumer products. This book describes the fundamentals of the copper-tin reaction and electromigration that underlie these reliability problems, and the potential for improving solder performance without the use of lead."--Jacket.
Other form:Print version: Tu, K.N. (King-ning), 1937- Solder joint technology. New York : Springer, c2007 9780387388908 0387388907