Solder joint technology : materials, properties, and reliability /
"Critical demands are placed on solder joint technology in flip chip and other high density packaging for advanced electronic consumer products. This book describes the fundamentals of the copper-tin reaction and electromigration that underlie these reliability problems, and the potential for i...
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| Author / Creator: | Tu, K. N. (King-Ning), 1937- |
|---|---|
| Imprint: | New York : Springer, c2007. |
| Description: | 1 online resource (xvi, 368 p.) : ill. |
| Language: | English |
| Series: | Springer series in materials science ; 92 Springer series in materials science ; 92. |
| Subject: | Welded joints. Welded joints -- Reliability. Solder and soldering. Metals -- Weldability. TECHNOLOGY & ENGINEERING -- Technical & Manufacturing Industries & Trades. Metals -- Weldability. Solder and soldering. Welded joints. Electronic books. |
| Format: | E-Resource Book |
| URL for this record: | http://pi.lib.uchicago.edu/1001/cat/bib/8882624 |