A new technique for wirebonding using indium spheres /

Saved in:
Bibliographic Details
Author / Creator:Olver, Kimberley A.
Imprint:Adelphi, MD : Army Research Laboratory, [2010]
Description:1 online resource (vi, 6) : col. ill.
Language:English
Series:ARL-TR ; 5240
ARL-TR (Aberdeen Proving Ground, Md.) ; 5240.
Subject:
Format: E-Resource U.S. Federal Government Document Book
URL for this record:http://pi.lib.uchicago.edu/1001/cat/bib/8535064
Hidden Bibliographic Details
Other authors / contributors:U.S. Army Research Laboratory.
Notes:Title from title screen (viewed on Sept. 28, 2011).
"July 2010."
Includes bibliographical references (p. 5).
Final.
GPO item no.:0324-A-01 (online)
Govt.docs classification:D 101.133:5240

MARC

LEADER 00000nam a2200000Ia 4500
001 8535064
003 ICU
005 20111205123100.0
006 m d f
007 cr mn|||||||||
008 110214s2010 mdua sbt f000 0 eng d
035 |a (OCoLC)713319161 
040 |a DTICE  |c DTICE  |d GPO  |d MvI 
074 |a 0324-A-01 (online) 
086 0 |a D 101.133:5240 
100 1 |a Olver, Kimberley A.  |0 http://id.loc.gov/authorities/names/no2012039647  |1 http://viaf.org/viaf/232836154 
245 1 2 |a A new technique for wirebonding using indium spheres /  |c Kimberley A. Olver. 
260 |a Adelphi, MD :  |b Army Research Laboratory,  |c [2010] 
300 |a 1 online resource (vi, 6) :  |b col. ill. 
336 |a text  |b txt  |2 rdacontent  |0 http://id.loc.gov/vocabulary/contentTypes/txt 
337 |a computer  |b c  |2 rdamedia  |0 http://id.loc.gov/vocabulary/mediaTypes/c 
338 |a online resource  |b cr  |2 rdacarrier  |0 http://id.loc.gov/vocabulary/carriers/cr 
490 1 |a ARL-TR ;  |v 5240 
513 |a Final. 
500 |a Title from title screen (viewed on Sept. 28, 2011). 
500 |a "July 2010." 
504 |a Includes bibliographical references (p. 5). 
650 0 |a Mercury cadmium tellurides.  |0 http://id.loc.gov/authorities/subjects/sh85083808 
650 0 |a Wire bonding (Electronic packaging)  |0 http://id.loc.gov/authorities/subjects/sh97004222 
650 7 |a Mercury cadmium tellurides.  |2 fast  |0 http://id.worldcat.org/fast/fst01017119 
650 7 |a Wire bonding (Electronic packaging)  |2 fast  |0 http://id.worldcat.org/fast/fst01176155 
710 2 |a U.S. Army Research Laboratory.  |0 http://id.loc.gov/authorities/names/no93023636  |1 http://viaf.org/viaf/149860432 
830 0 |a ARL-TR (Aberdeen Proving Ground, Md.) ;  |v 5240. 
856 4 0 |u http://purl.fdlp.gov/GPO/gpo13330 
903 |a HeVa 
929 |a eresource 
999 f f |i a5c79987-a50b-53eb-8e3b-27f556dfcb67  |s 4bfa14dd-21b6-53b8-ac56-37fca5f5778b 
928 |l Online  |c UC-FullText  |u http://purl.fdlp.gov/GPO/gpo13330  |g ebooks  |i 7106584