Three-dimensional integration and modeling : a revolution in RF and wireless packaging /

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Bibliographic Details
Author / Creator:	Lee, Jong-Hoon.
Imprint:	San Rafael, Calif. (1537 Fourth Street, San Rafael, CA 94901 USA) : Morgan & Claypool Publishers, c2008.
Description:	1 electronic text (x, 108 p. : ill. (some col.)) : digital file.
Language:	English
Series:	Synthesis lectures on computational electromagnetics, 1932-1716 ; #17 Synthesis lectures on computational electromagnetics (Online), #17.
Subject:	Microelectronic packaging. Millimeter wave communication systems. Wireless communication systems. Microelectronic packaging. Millimeter wave communication systems. Wireless communication systems.
Format:	E-Resource Book
URL for this record:	http://pi.lib.uchicago.edu/1001/cat/bib/8512779

Hidden Bibliographic Details
Other authors / contributors:	Tentzeris, Manos M.
ISBN:	1598292455 (electronic bk.) 9781598292459 (electronic bk.) 1598292447 (pbk.) 9781598292442 (pbk.)
Notes:	Title from PDF t.p. (viewed Oct. 19, 2008). Series from website. Includes bibliographical references (p. 99-106). Abstract freely available; full-text restricted to subscribers or individual document purchasers. Also available in print. Mode of access: World Wide Web. System requirements: Adobe Acrobat reader.
Summary:	This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.
Standard no.:	10.2200/S00080ED1V01Y200710CEM017

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