Properties of copper and copper alloys at cryogenic temperatures /

Properties of copper and copper alloys at cryogenic temperatures /

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Bibliographic Details
Author / Creator:	Simon, N. J.
Imprint:	Boulder, CO : U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology ; Washington, D.C. : For sale by the Supt. of Docs., U.S. G.P.O. ; [Springfield, VA : Order from National Technical Information Service], 1992.
Description:	1 v. (various pagings) : ill. ; 28 cm.
Language:	English
Series:	NIST monograph ; 177
Subject:	Copper -- Thermal properties. Copper alloys -- Thermal properties. Low temperature research. Metals -- Effect of low temperatures on. Copper alloys -- Thermal properties. Copper -- Thermal properties. Low temperature research. Metals -- Effect of low temperatures on.
Format:	Microform U.S. Federal Government Document Book
URL for this record:	http://pi.lib.uchicago.edu/1001/cat/bib/3303709

Hidden Bibliographic Details
Other authors / contributors:	Drexler, E. S. Reed, R. P. (Richard Palmer), 1934- International Copper Association. National Institute of Standards and Technology (U.S.)
Notes:	Distributed to depository libraries in microfiche. Shipping list no.: 92-1556-M. "February 1992." Includes bibliographical references. Final. Microfiche. [Washington, D.C.?] : Supt. of Docs., U.S. G.P.O., [1992] 9 microfiches : negative. Project no. 434.
GPO item no.:	0247-A (MF)
Govt.docs classification:	C 13.44:177

Regenstein, B Level, Science Microforms

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Holdings details from Regenstein, B Level, Science Microforms
Call Number:	microfc TA480.C7S55 1992 c.1
Issues:	fiche 1-9
c.1	Available Loan period: standard loan Need help? - Ask a Librarian