HOTPAC : programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML /

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Bibliographic Details
Author / Creator:Albers, John.
Imprint:Gaithersburg, MD : U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology ; Washington, DC : For sale by the Supt. of Docs., U.S. G.P.O., 1995.
Description:vi, 87 p. ; 28 cm.
Language:English
Series:Semiconductor measurement technology.
NIST special publication 400-96
Subject:Semiconductors -- Thermal properties.
Thermal analysis -- Computer programs.
Semiconductors -- Thermal properties.
Thermal analysis -- Computer programs.
Format: Microform U.S. Federal Government Document Book
URL for this record:http://pi.lib.uchicago.edu/1001/cat/bib/3221774
Hidden Bibliographic Details
Varying Form of Title:HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program ...
Programs for thermal analysis including version 3.0 of the TXYZ program ...
Other authors / contributors:National Institute of Standards and Technology (U.S.)
Notes:Distributed to depository libraries in microfiche.
Shipping list no.: 95-0785-M.
"August 1995."
Includes bibliographical references (p. 47-49).
Microfiche. [Washington, D.C.?] : Supt. of Docs., U.S. G.P.O., [1995] 2 microfiches : negative.
GPO item no.:0247 (MF)
Govt.docs classification:C 13.10:400-96

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