HOTPAC : programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML /

HOTPAC : programs for thermal analysis including version 3.0 of the TXYZ program, TXYZ 30, and the thermal multilayer program, TML /

Saved in:

Bibliographic Details
Author / Creator:	Albers, John.
Imprint:	Gaithersburg, MD : U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology ; Washington, DC : For sale by the Supt. of Docs., U.S. G.P.O., 1995.
Description:	vi, 87 p. ; 28 cm.
Language:	English
Series:	Semiconductor measurement technology. NIST special publication 400-96
Subject:	Semiconductors -- Thermal properties. Thermal analysis -- Computer programs. Semiconductors -- Thermal properties. Thermal analysis -- Computer programs.
Format:	Microform U.S. Federal Government Document Book
URL for this record:	http://pi.lib.uchicago.edu/1001/cat/bib/3221774

Hidden Bibliographic Details
Varying Form of Title:	HOTPAC, programs for thermal analysis including version 3.0 of the TXYZ program ... Programs for thermal analysis including version 3.0 of the TXYZ program ...
Other authors / contributors:	National Institute of Standards and Technology (U.S.)
Notes:	Distributed to depository libraries in microfiche. Shipping list no.: 95-0785-M. "August 1995." Includes bibliographical references (p. 47-49). Microfiche. [Washington, D.C.?] : Supt. of Docs., U.S. G.P.O., [1995] 2 microfiches : negative.
GPO item no.:	0247 (MF)
Govt.docs classification:	C 13.10:400-96

Regenstein, B Level, Science Microforms

Loading map link

Holdings details from Regenstein, B Level, Science Microforms
Call Number:	microfc TK7871.85.A434 1995
c.1	Available Loan period: standard loan Need help? - Ask a Librarian