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19970811020600.0 |
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930507s1994 maua b 001 0 eng |
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|a 93010293
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|a 0121176800 (alk. paper) :
|c $64.50
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|a (ICU)BID17067388
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|a (OCoLC)27815047
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|c DLC
|d DLC$dOrLoB
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|a QC611.98.H54
|b B68 1994
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| 082 |
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|a 537.6/23
|2 20
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| 100 |
1 |
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|a Bourdillon, A.,
|d 1944-
|0 http://id.loc.gov/authorities/names/n93024309
|1 http://viaf.org/viaf/97537
|
| 245 |
1 |
0 |
|a High temperature superconductors :
|b processing and science /
|c A. Bourdillon and N.X. Tan Bourdillon.
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| 260 |
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|a Boston :
|b Academic Press,
|c c1994.
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| 300 |
|
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|a xx, 288 p. :
|b ill. ;
|c 24 cm.
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| 336 |
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|a text
|b txt
|2 rdacontent
|0 http://id.loc.gov/vocabulary/contentTypes/txt
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| 337 |
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|a unmediated
|b n
|2 rdamedia
|0 http://id.loc.gov/vocabulary/mediaTypes/n
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| 338 |
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|a volume
|b nc
|2 rdacarrier
|0 http://id.loc.gov/vocabulary/carriers/nc
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| 504 |
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|a Includes bibliographical references and index.
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| 505 |
2 |
0 |
|g I.
|t The Superconducting State.
|g 1.
|t History.
|g 2.
|t Phenomena.
|g 2.1.
|t Critical Temperature, Critical Field and Critical Current.
|g 2.2.
|t The Meissner-Ochsenfeld Effect.
|g 2.3.
|t Penetration Depth and Coherence Length.
|g 2.4.
|t Thermal Properties.
|g 2.5.
|t Flux Pinning.
|g 2.6.
|t Tunneling.
|g 3.
|t Theoretical Outline.
|g 3.1.
|t The Ginzburg-Landau Theory.
|g 3.2.
|t BCS Theory --
|g II.
|t High Temperature Superconductors.
|g 1.
|t Materials Classification.
|g 1.1.
|t Alkaline Earth Doped La[subscript 2]CuO[subscript 4].
|g 1.2.
|t The Y-Ba-Cu-O System.
|g 1.3.
|t [actual symbol not reproducible] Systems.
|g 1.4.
|t Other Systems.
|g 1.5.
|t Summary of Typical Processing Parameters.
|g 2.
|t Defects and Crystal Chemistry.
|g 2.1.
|t Oxygen Vacancies and Hole Creation.
|g 2.2.
|t Lattice Defects.
|g 2.3.
|t Flux Pinning Sites.
|g 3.
|t Metallic States.
|g 3.1.
|t Energy Levels and Bands.
|g 3.2.
|t Measurements of Carrier Densities --
|g III.
|t Phase Equilibria.
|g 1.
|t Phase Equilibria.
|g 2.
|t Phase Diagrams for LBCO.
|g 3.
|t Phase Diagrams for Y123.
|g 4.
|t Phase Diagrams for Bi2223 and T12223 --
|g IV.
|t Powder Processing, Bulk Formation and Densification.
|g 1.
|t Chemical Reaction.
|g 1.1.
|t Calcination.
|g 1.2.
|t Sintering.
|g 2.
|t Powder Processing.
|g 2.1.
|t Milling Media.
|g 2.2.
|t Co-precipitation.
|g 2.3.
|t Aerosol Techniques.
|g 2.4.
|t Sol-gel.
|g 2.5.
|t Precursor Routes.
|g 3.
|t Shaping and Densification.
|g 3.1.
|t Pelletization.
|g 3.2.
|t Wire Formation.
|g 3.3.
|t Tape Formation.
|g 3.4.
|t Coils.
|g 3.5.
|t Liquid Phase Sintering.
|g 3.6.
|t Hot Uniaxial Pressing.
|g 3.7.
|t Cold and Hot Isostatic Pressing.
|g 3.8.
|t Joining.
|g 3.9.
|t Other Methods --
|g V.
|t Thin Films.
|g 1.
|t Fabrication Principles.
|g 1.1.
|t In Situ and ex Situ Growth.
|g 1.2.
|t Oxygen Pressure.
|g 1.3.
|t Stoichiometry.
|g 1.4.
|t Co-deposition from Multiple Sources.
|g 1.5.
|t Substrates.
|g 1.6.
|t [alpha]-Axis Films.
|g 1.7.
|t Heterostructures.
|g 1.8.
|t Film Quality.
|g 2.
|t Deposition Techniques.
|g 2.1.
|t Thermal Evaporation.
|g 2.2.
|t Sputtering.
|g 2.3.
|t Laser Ablation.
|g 2.4.
|t Chemical Vapor Deposition.
|g 2.5.
|t Metalorganic Solution Deposition.
|g 3.
|t Weak Links and Transport Current --
|g VI.
|t Alignment in Bulk Material.
|g 1.
|t Partial Melting.
|g 2.
|t Directional Solidification.
|g 2.1.
|t Zone Melting.
|g 2.2.
|t Float Zone Grown Single Crystal Fibers.
|g 2.3.
|t Growth of Single Crystals.
|g 3.
|t Other Methods for Growing Fibers.
|g 4.
|t Deformation Alignment.
|g 5.
|t Magnetic Alignment.
|g 6.
|t Diffusion Texture through Precursors.
|g 7.
|t Second Phase Inclusions --
|g VII.
|t Dopants, Impurities and Chemical Stability.
|g 1.
|t Dopants.
|g 1.1.
|t Alkali Metals.
|g 1.2.
|t Alkaline Earths.
|g 1.3.
|t Transition Metals.
|g 1.4.
|t Noble Metals.
|g 1.5.
|t Pb Doping in Bi2223.
|g 1.6.
|t Halides.
|g 1.7.
|t Other Dopants.
|g 2.
|t Contamination in Materials Preparation.
|g 2.1.
|t Purity of Starting Powders.
|g 2.2.
|t Carbon.
|g 2.3.
|t Nitrates.
|g 2.4.
|t Contaminants from Milling Media.
|g 3.
|t Corrosion.
|g 3.1.
|t Electrochemistry.
|g 3.2.
|t Aqueous Environments.
|g 3.3.
|t Acid Solutions.
|g 3.4.
|t Basic Solutions.
|g 3.5.
|t Organic Solutions.
|g 3.6.
|t Protection --
|g VIII.
|t Characterization.
|g 1.
|t Electricity and Magnetism.
|g 1.1.
|t The Four-Probe Technique.
|g 1.2.
|t Electrical Contacts.
|g 1.3.
|t Magnetic Susceptibility.
|g 2.
|t Crystal Structures.
|g 2.1.
|t Neutron Diffraction.
|g 2.2.
|t X-Ray Diffraction.
|g 2.3.
|t Electron Diffraction.
|g 2.4.
|t Characterization of Texture.
|g 3.
|t Microstructures.
|g 3.1.
|t Electron Microscopy.
|g 3.2.
|t Optical Microscopy.
|g 3.3.
|t Grain Boundaries.
|g 3.4.
|t Scanning Tunneling Microscopy.
|g 3.5.
|t Rutherford Backscattering.
|g 4.
|t Wet Chemistry.
|g 4.1.
|t Volumetric Measurement.
|g 4.2.
|t Iodometric Titration --
|g IX.
|t Applications.
|g 1.
|t Bulk Material.
|g 1.1.
|t Cables.
|g 1.2.
|t Magnets.
|g 1.3.
|t Magnetic Bearings.
|g 1.4.
|t Magnetic Shields.
|g 1.5.
|t Requisite Critical Current Densities.
|g 2.
|t Thin Films.
|g 2.1.
|t SQUIDs.
|g 2.2.
|t Microwave Devices.
|g 2.3.
|t Bolometers.
|g 2.4.
|t Interconnects for High Speed Circuits.
|g 2.5.
|t Digital Electronic Devices.
|t Appendix I. Magnetic Units in SI and cgs Systems --
|t Appendix II. Toxicity Data --
|t Appendix III. A15 Compounds.
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| 650 |
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|a High temperature superconductors
|0 http://id.loc.gov/authorities/subjects/sh88004641
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| 650 |
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|a High temperature superconductors
|x Industrial applications.
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| 650 |
|
7 |
|a High temperature superconductors.
|2 fast
|0 http://id.worldcat.org/fast/fst00956487
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| 650 |
|
7 |
|a High temperature superconductors
|x Industrial applications.
|2 fast
|0 http://id.worldcat.org/fast/fst00956489
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| 700 |
2 |
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|a Tan Bourdillon, N. X.
|0 http://id.loc.gov/authorities/names/n93024313
|1 http://viaf.org/viaf/41927259
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|a ICU
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|a ToCBNA
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|a HeVa
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|a Hathi
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|i 2c62d6d9-ae1c-55b2-90c0-086b1aca3e4c
|s 86553e06-b7b3-5f2a-90c1-72f464ade574
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| 928 |
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|t Library of Congress classification
|a QC611.98.H54B680 1994
|l JCL
|c JCL-Sci
|i 2222462
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| 927 |
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|t Library of Congress classification
|a QC611.98.H54B680 1994
|l JCL
|c JCL-Sci
|e CRERAR
|b 43022793
|i 2840370
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