Interconnection development for InP-HBT terahertz circuits

Interconnection development for InP-HBT terahertz circuits

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Bibliographic Details
Author / Creator:	Stoppel, Dimitri.
Imprint:	Göttingen : Cuvillier Verlag, 2020.
Description:	1 online resource (157 pages)
Language:	English
Series:	Innovationen mit Mikrowellen und Licht. Forschungsberichte aus dem Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik ; v. 58 Innovationen mit Mikrowellen und Licht. Forschungsberichte aus dem Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik.
Subject:	Terahertz technology. Printed circuits -- Design and construction. Printed circuits -- Design and construction. Terahertz technology.
Format:	E-Resource Book
URL for this record:	http://pi.lib.uchicago.edu/1001/cat/bib/12651001

Hidden Bibliographic Details
ISBN:	3736962045 9783736962040
Notes:	Print version record.
Other form:	Print version: Stoppel, Dimitri. Interconnection development for InP-HBT terahertz circuits. Göttingen : Cuvillier Verlag, ©2020 9783736972049

Table of Contents:

Intro
1. Introduction
2. InP HBT transferred-substrate process
3. Plasma etching of benzocyclobutene
4. Nickel chrome thin film resistors
5. Through silicon vias in atransferred-substrate process
6. Summary
List of Figures
List of Tables
Bibliography
Appendix A Publications
Appendix B Acronyms