Blockchain and applications : international congress /

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Bibliographic Details
Meeting name:International Congress on Blockchain and Applications (1st : 2019 : Ávila, Spain).
Imprint:Cham, Switzerland : Springer, [2020]
Description:1 online resource.
Series:Advances in intelligent systems and computing, 2194-5365 ; volume 1010
Advances in intelligent systems and computing ; 1010.
Subject:Blockchains (Databases) -- Congresses.
COMPUTERS / Databases / General.
Blockchains (Databases)
Electronic books.
Conference papers and proceedings.
Format: E-Resource Book
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Other authors / contributors:Prieto, Javier (Prieto Tejedor), editor.
Das, Ashok Kumar (Professor of computer science), editor.
Ferretti, Stefano, editor.
Pinto, António, editor.
Corchado, Juan Manuel, editor.
Notes:Proceedings of the 1st International Congress on Blockchain and Applications, held in 2019 in Ávila, Spain.
Includes bibliographical references and index.
Online resource; title from PDF title page (EBSCO, viewed June 27, 2019).
Summary:This book gathers the refereed proceedings of the 1st International Congress on Blockchain and Applications 2019, BLOCKCHAIN19, held in Ávila, Spain, in June 2019. Among the scientific community, blockchain and artificial intelligence are broadly considered to offer a promising combination that could transform the production and manufacturing industry, media, finance, insurance, e-government, etc. Nevertheless, there is no generally accepted approach, nor established best practices, for combining blockchain and artificial intelligence. The 21 papers presented here were carefully reviewed and selected from over 40 submissions. They highlight the latest advances in blockchain, artificial intelligence and their application domains, exploring innovative ideas, guidelines, theories, models, technologies, and tools, and identifying critical issues and challenges that researchers and practitioners will face in the near future. We wish to thank the sponsors: IEEE Systems Man and Cybernetics Society, Spain Section Chapter, and the IEEE Spain Section (Technical Co-Sponsor), IBM, Indra, Viewnext, Global Exchange, AEPIA, APPIA and AIR institute.
Standard no.:10.1007/978-3-030-23