Material engineering and application /

Material engineering and application /

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Bibliographic Details
Meeting name:	International Conference on Material Engineering and Application (3rd : 2018 : Hong Kong, China)
Imprint:	Zurich : Trans Tech Publications, 2018.
Description:	1 online resource : color illustrations
Language:	English
Series:	Key Engineering Materials ; volume 789 Key engineering materials ; v. 789.
Subject:	Engineering -- Congresses. Materials science -- Congresses. Information technology -- Congresses. Materials -- Congresses. Engineering. Information technology. Materials. Materials science. Conference papers and proceedings.
Format:	E-Resource Book
URL for this record:	http://pi.lib.uchicago.edu/1001/cat/bib/12021567

Hidden Bibliographic Details
Other authors / contributors:	Kaloop, Mosbeh., editor. Hu, Jongwan, editor.
ISBN:	9783035733839 303573383X 9783035713831 3035713839
Notes:	Includes bibliographical references and index. Online resource; title from PDF title page (EBSCO, viewed Feburary 5, 2019).
Other form:	Print version: International Conference on Material Engineering and Application (3rd : 2018 : Hong Kong, China). Material engineering and application. Zurich : Trans Tech Publications, 2018 3035713839 9783035713831

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