Material engineering and application /
Saved in:
Meeting name: | International Conference on Material Engineering and Application (3rd : 2018 : Hong Kong, China) |
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Imprint: | Zurich : Trans Tech Publications, 2018. |
Description: | 1 online resource : color illustrations |
Language: | English |
Series: | Key Engineering Materials ; volume 789 Key engineering materials ; v. 789. |
Subject: | Engineering -- Congresses. Materials science -- Congresses. Information technology -- Congresses. Materials -- Congresses. TECHNOLOGY & ENGINEERING -- Engineering (General) TECHNOLOGY & ENGINEERING -- Reference. Engineering. Information technology. Materials. Materials science. Electronic books. Conference papers and proceedings. |
Format: | E-Resource Book |
URL for this record: | http://pi.lib.uchicago.edu/1001/cat/bib/12021567 |
Other authors / contributors: | Kaloop, Mosbeh., editor. Hu, Jongwan, editor. |
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ISBN: | 9783035733839 303573383X 9783035713831 3035713839 |
Notes: | Includes bibliographical references and index. Online resource; title from PDF title page (EBSCO, viewed Feburary 5, 2019). |
Other form: | Print version: International Conference on Material Engineering and Application (3rd : 2018 : Hong Kong, China). Material engineering and application. Zurich : Trans Tech Publications, 2018 3035713839 9783035713831 |
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