Systems-level packaging for millimeter-wave transceivers /

Systems-level packaging for millimeter-wave transceivers /

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Bibliographic Details
Author / Creator:	Božanić, Mladen, 1982- author.
Imprint:	Cham, Switzerland : Springer, [2019]
Description:	1 online resource
Language:	English
Series:	Smart sensors, measurement and instrumentation ; volume 34 Smart sensors, measurement and instrumentation ; 34.
Subject:	Millimeter wave communication systems. Gigabit communications -- Equipment and supplies. TECHNOLOGY & ENGINEERING -- Mechanical. Millimeter wave communication systems. Electronic books.
Format:	E-Resource Book
URL for this record:	http://pi.lib.uchicago.edu/1001/cat/bib/11852243

Hidden Bibliographic Details
Other authors / contributors:	Sinha, Saurabh, author.
ISBN:	9783030146900 3030146901 9783030146917 303014691X 9783030146924 3030146928 3030146898 9783030146894
Digital file characteristics:	text file PDF
Notes:	Includes bibliographical references. Online resource; title from digital title page (viewed on April 11, 2019).
Summary:	This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
Other form:	Print version: Božanić, Mladen, 1982- Systems-level packaging for millimeter-wave transceivers. Cham, Switzerland : Springer, [2019] 3030146898 9783030146894
Standard no.:	10.1007/978-3-030-14690-0