Key engineering materials and computer science : selected, peer reviewed papers from the 2011 international conference on key engineering materials and computer science (KEMCS 2011), August 6-7, 2011, Dalian, China /
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Meeting name: | International Conference on Key Engineering Materials and Computer Science (2011 : Dalian, China) |
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Imprint: | Durnten-Zurich, Switzerland ; Enfield, NH : Trans Tech Publications, ©2011. |
Description: | 1 online resource (xii, 678 pages) : illustrations |
Language: | English |
Series: | Advanced materials research ; 1022-6680 ; v. 320 Advanced materials research ; v. 320. |
Subject: | |
Format: | E-Resource Book |
URL for this record: | http://pi.lib.uchicago.edu/1001/cat/bib/11181115 |
Other authors / contributors: | Hu, Jun. Luo, Qi. |
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ISBN: | 9783038136316 303813631X 9783037852118 3037852119 |
Notes: | Includes bibliographical references and index. Print version record. |
Summary: | The International Conference on Key Engineering Materials and Computer Science (KEMCS 2011), held in Dalian, China, was the first conference to be dedicated to issues related to key engineering materials and computer science. A major goal and feature of KEMCS 2011 was to bring together academics, engineers and industrial researchers in order to exchange and share their experiences and research results touching most aspects of key engineering materials and computer science, and to discuss the practical challenges encountered and the solutions adopted. This work clearly makes a valuable contribu. |
Other form: | Print version: International Conference on Key Engineering Materials and Computer Science (2011 : Dalian, China). Key engineering materials and computer science. Durnten-Zurich, Switzerland ; Enfield, NH : Trans Tech Publications, ©2011 9783037852118 |
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