Key engineering materials and computer science : selected, peer reviewed papers from the 2011 international conference on key engineering materials and computer science (KEMCS 2011), August 6-7, 2011, Dalian, China /

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Bibliographic Details
Meeting name:	International Conference on Key Engineering Materials and Computer Science (2011 : Dalian, China)
Imprint:	Durnten-Zurich, Switzerland ; Enfield, NH : Trans Tech Publications, ©2011.
Description:	1 online resource (xii, 678 pages) : illustrations
Language:	English
Series:	Advanced materials research ; 1022-6680 ; v. 320 Advanced materials research ; v. 320.
Subject:	Materials -- Congresses. Materials science -- Congresses. TECHNOLOGY & ENGINEERING -- Material Science. Materials. Materials science. Electronic books. Electronic books. Conference papers and proceedings.
Format:	E-Resource Book
URL for this record:	http://pi.lib.uchicago.edu/1001/cat/bib/11181115

Hidden Bibliographic Details
Other authors / contributors:	Hu, Jun. Luo, Qi.
ISBN:	9783038136316 303813631X 9783037852118 3037852119
Notes:	Includes bibliographical references and index. Print version record.
Summary:	The International Conference on Key Engineering Materials and Computer Science (KEMCS 2011), held in Dalian, China, was the first conference to be dedicated to issues related to key engineering materials and computer science. A major goal and feature of KEMCS 2011 was to bring together academics, engineers and industrial researchers in order to exchange and share their experiences and research results touching most aspects of key engineering materials and computer science, and to discuss the practical challenges encountered and the solutions adopted. This work clearly makes a valuable contribu.
Other form:	Print version: International Conference on Key Engineering Materials and Computer Science (2011 : Dalian, China). Key engineering materials and computer science. Durnten-Zurich, Switzerland ; Enfield, NH : Trans Tech Publications, ©2011 9783037852118

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