Key engineering materials and computer science : selected, peer reviewed papers from the 2011 international conference on key engineering materials and computer science (KEMCS 2011), August 6-7, 2011, Dalian, China /

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Bibliographic Details
Meeting name:International Conference on Key Engineering Materials and Computer Science (2011 : Dalian, China)
Imprint:Durnten-Zurich, Switzerland ; Enfield, NH : Trans Tech Publications, ©2011.
Description:1 online resource (xii, 678 pages) : illustrations
Language:English
Series:Advanced materials research ; 1022-6680 ; v. 320
Advanced materials research ; v. 320.
Subject:Materials -- Congresses.
Materials science -- Congresses.
TECHNOLOGY & ENGINEERING -- Material Science.
Materials.
Materials science.
Electronic books.
Electronic books.
Conference papers and proceedings.
Format: E-Resource Book
URL for this record:http://pi.lib.uchicago.edu/1001/cat/bib/11181115
Hidden Bibliographic Details
Other authors / contributors:Hu, Jun.
Luo, Qi.
ISBN:9783038136316
303813631X
9783037852118
3037852119
Notes:Includes bibliographical references and index.
Print version record.
Summary:The International Conference on Key Engineering Materials and Computer Science (KEMCS 2011), held in Dalian, China, was the first conference to be dedicated to issues related to key engineering materials and computer science. A major goal and feature of KEMCS 2011 was to bring together academics, engineers and industrial researchers in order to exchange and share their experiences and research results touching most aspects of key engineering materials and computer science, and to discuss the practical challenges encountered and the solutions adopted. This work clearly makes a valuable contribu.
Other form:Print version: International Conference on Key Engineering Materials and Computer Science (2011 : Dalian, China). Key engineering materials and computer science. Durnten-Zurich, Switzerland ; Enfield, NH : Trans Tech Publications, ©2011 9783037852118
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245 1 0 |a Key engineering materials and computer science :  |b selected, peer reviewed papers from the 2011 international conference on key engineering materials and computer science (KEMCS 2011), August 6-7, 2011, Dalian, China /  |c edited by Jun Hu and Qi Luo. 
260 |a Durnten-Zurich, Switzerland ;  |a Enfield, NH :  |b Trans Tech Publications,  |c ©2011. 
300 |a 1 online resource (xii, 678 pages) :  |b illustrations 
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505 8 |6 880-01  |a Effect of Surface Characteristics on Bioactivity of Ceramic Coating on Ti6al4v by Plasma Electrolytic OxidationAtomistic Simulations of Heat Transport in Carbon Nanotubes Effected by Temperature and Stretch Strain; A Study on Rotary Expanding Process of Large-Diameter Hot-Rolled Seamless Gas Cylinder with Finite Element Analysis; Effects of Interlaminal Contaminants on Mechanical Properties of Composite Laminates; Automatic Measurement of Concrete Deformation Field under Uniaxial Compression Based on DSCM; Effect of the Heat Treatment Process on Machinability of TC4 Alloy. 
505 8 |6 880-02  |a Effect of Laser Hardening Parameters on the Valve Seat of Worm Cast IronResearch on Preparation and Hydrolysis Resistance of Poly(lactic acid) Modified by MDI; Application and Evaluation of Halbach-Like Magnet Arrays to Magnetic Drug Targeting; The Effects of Solvents to ZnO:Al Transparent Conductive Thin Films Synthesized by Sol-Gel Method; Density-Controlled Growth of Well-Aligned ZnO Nanowires Using Hydrothermal Method; Synthesis of ZnO Polycrystalline Flakes Using Sol-Gel Method; Synthesis and Characterization of SiO2/ZnO Core-Shell Spheres. 
505 8 |a Research on the Mathematical Description of Style Image of Machining CentersToward Risk Assessment of Explosion Hazard: Experimental Determination of Flame Fractal Dimension; Investigation on Sub-Rapid Solidification Behavior of Semi-Solid Magnesium Alloy Metal; An Investigation about the Effect of Depth of Cut on Surface Integrity in Creep Feed Grinding of INC 792-5A; Fabrication and Electrical Properties of P(VDF-TrFE)/Bi3.5Nd0.5Ti3O12 Bi-Layer Composite Ferroelectric Thin Films; Study on Low Application Temperature Process of Three Layer Polyethylene Coating. 
520 |a The International Conference on Key Engineering Materials and Computer Science (KEMCS 2011), held in Dalian, China, was the first conference to be dedicated to issues related to key engineering materials and computer science. A major goal and feature of KEMCS 2011 was to bring together academics, engineers and industrial researchers in order to exchange and share their experiences and research results touching most aspects of key engineering materials and computer science, and to discuss the practical challenges encountered and the solutions adopted. This work clearly makes a valuable contribu. 
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700 1 |a Luo, Qi. 
776 0 8 |i Print version:  |a International Conference on Key Engineering Materials and Computer Science (2011 : Dalian, China).  |t Key engineering materials and computer science.  |d Durnten-Zurich, Switzerland ; Enfield, NH : Trans Tech Publications, ©2011  |z 9783037852118  |w (OCoLC)758982177 
830 0 |a Advanced materials research ;  |v v. 320.  |0 http://id.loc.gov/authorities/names/n99255722 
880 0 |6 505-01/(S  |a Key Engineering Materials and Computer Science; Preface, Organizing Committee; Table of Contents; Chapter 1: Key Engineering Materials; TEM and DSC Studies on the Synthetic Diamond Grown from Fe-Ni-C-B System under HPHT; Aging Hardening of γ1-Ti4Nb3Al9 Phase in Ti-48Al-10Nb Alloy; Effects of High Pressure on the Solidification Microstructure of Al-Si Alloy; Finite Element Analysis about the Properties of CFG-Pile Composite Foundation Based on Parametric Language PYTHON; Topologically Close-Packed Phase Precipitation in Ni-Based Superalloys. 
880 8 |6 505-02/(S  |a Effect of γ-Radiation on the Property of Polypropylene/Nylon-6 BlendsOn Dynamical Simulations in Abrasive Flow Finishing; Fatigue Response of Centrally Notched Ti/APC-2 Nanocopmosite Laminates due to Two-Step Loads; Nonlinear Transport of Short Period AlGaN/GaN Superlattice as a Terahertz Oscillator; A Study on the Relation between Die Roll Height and Die Chamfer Shape in Fine Blanking for Special Gear; Preparation of IPNs SBS/PBMA-b-PMA and Effect of Compatibility with PVC; Mechanical Analysis of Steel Beam and Steel-Concrete Combined Section Pavement in Long-Span Hybrid Girder Bridge. 
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