Silicon-based millimeter-wave technology measurement, modeling and applications /
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Imprint: | Amsterdam : Elsevier/Academic Press, 2012. |
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Description: | 1 online resource (xx, 483 pages) : illustrations. |
Language: | English |
Series: | Advances in imaging and electron physics ; v. 174 Advances in imaging and electron physics ; v. 174. |
Subject: | Millimeter wave devices. Silicon crystals. TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- General. TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- Integrated. Millimeter wave devices. Silicon crystals. Electronic books. |
Format: | E-Resource Book |
URL for this record: | http://pi.lib.uchicago.edu/1001/cat/bib/11169419 |
Table of Contents:
- Front Cover; Editor-in-Chief; Silicon-Based Millimeter-wave Technology; Copyright; Contents; Preface; Future Contributions; Foreword; Contributors; Acknowledgements; Permission Acknowledgments; Chapter1
- Measurement Techniques and Issues; 1. INTRODUCTION; 2. OVERVIEW OF MEASUREMENT METHODS AND INSTRUMENTATION; 3. TRANSMISSION LINE AND S-PARAMETERS; 4. MILLIMETER-WAVE NETWORK ANALYZERS; 5. CASCADING OF S-PARAMETERS AND TRANSMISSION/TRANSFER T-PARAMETERS; 6. CALIBRATION AND DE-EMBEDDING AT MM-WAVES; REFERENCES; Chapter2
- Transmission Lines and Passive Components; 1. INTRODUCTION.
- 2. SILICON INTEGRATED CIRCUITS AND TECHNOLOGY3. TRANSMISSION LINES; 4. ELECTROMAGNETICS OF TRANSMISSION LINES AND THEIR DISCONTINUITIES; 5. TRANSITIONS; 6. CAPACITORS, INDUCTORS, AND RESISTORS; 7. RESONATORS AND FILTERS FOR SILICON INTEGRATIONS OF INCREASED FREQUENCIES; 8. POWER DIVIDERS AND DIRECTIONAL COUPLERS FOR SI-INTEGRATED CIRCUITS; 9. PACKAGING OF MILLIMETER-WAVE COMPONENTS AND CHIPS; 10. CONCLUSIONS; REFERENCES; Chapter3
- Modeling and Design of High-Frequency Structures Using Artificial Neural Networks and Space Mapping; 1. INTRODUCTION TO ARTIFICIAL NEURAL NETWORKS.
- 2. STRUCTURE OF ARTIFICIAL NEURAL NETWORKS3. ACTIVATION FUNCTIONS; 4. ASPECTS OF ARTIFICIAL NEURAL NETWORK TRAINING; 5. APPLICATIONS OF ARTIFICIAL NEURAL NETWORKS TO MODELING OF ON-CHIP HIGH-FREQUENCY DEVICES; 6. INTRODUCTION TO SPACE MAPPING; 7. THE SPACE MAPPING CONCEPT; 8. THE PARAMETER EXTRACTION STEP; 9. SPACE MAPPING APPROACHES; 10. SPACE MAPPING OPTIMIZATION AND MODELING; 11. APPLICATIONS OF SPACE MAPPING; 12. CONCLUSIONS; REFERENCES; Chapter4
- Nanoscale FETs; 1. TYPES AND PERFORMANCES OF NANOSCALE MOSFETS; 2. SMALL-SIGNAL ANALYSIS OF MOSFETS AT HIGH FREQUENCIES.
- 3. HF NOISE MODELING OF MULTIPLE-GATE SOI AND LATERALLY ASYMMETRIC CHANNEL MOS DEVICES4. CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES; Chapter5
- RF MEMS Devices for Communication Systems; 1. INTRODUCTION; 2. GENERAL DESIGN CONSIDERATIONS; 3. MEMS REDUNDANCY SWITCH MATRICES; 4. RF MEMS CROSSBAR SWITCH MATRICES; 5. RF MEMS SWITCH MATRICES WITH PAIRWISE CONNECTION; 6. SWITCH MATRICES FOR HIGH-POWER APPLICATIONS; 7. TUNABLE RF MEMS COMPONENTS; 8. DISCUSSION; REFERENCES; Chapter6
- Substrate-Integrated Antennas on Silicon; 1. INTRODUCTION; 2. SOME ANTENNA FUNDAMENTALS.
- 3. FABRICATION OF ANTENNAS ON SILICON SUBSTRATES4. TYPES OF SILICON-BASED INTEGRATED ANTENNAS; 5. INTEGRATED ANTENNA MEASUREMENTS; 6. CROSSTALK AND CIRCUIT NOISE; 7. EFFECT OF SILICON SUBSTRATE RESISTIVITY ON ANTENNA TRANSMISSION GAIN; 8. APPLICATIONS IN WIRELESS PERSONAL AREA NETWORKS (WPANS); 9. SINGLE-CHIP RADIO; 10. PHOTONICALLY RECONFIGURABLE ANTENNAS; 11. CARBON NANOTUBE (CNT) ANTENNAS; 12. VEHICULAR APPLICATIONS; REFERENCES; Color Plates; Volume 151; Volume 152; Volume 153; Volume 154; Volume 155; Volume 156; Volume 157; Volume 158; Volume 159; Volume 160; Volume 161; Volume 162; Volume 163.