Solder joint reliability assessment : finite element simulation methodology /
This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder jointsubjected to reliability test conditions are elaborated. These cover...
|Author / Creator:||Tamin, Mohd N., author.|
|Imprint:||Cham : Springer, 2014.|
|Description:||1 online resource.|
|Series:||Advanced structured materials ; volume 37|
Advanced structured materials ; v. 37.
|Subject:||Solder and soldering.|
Welded joints -- Reliability.
TECHNOLOGY & ENGINEERING -- Technical & Manufacturing Industries & Trades.
Science des matériaux.
Solder and soldering.
|URL for this record:||http://pi.lib.uchicago.edu/1001/cat/bib/11084785|