Solder joint reliability assessment : finite element simulation methodology /
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Author / Creator: | Tamin, Mohd N., author. |
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Imprint: | Cham : Springer, 2014. |
Description: | 1 online resource. |
Language: | English |
Series: | Advanced structured materials ; volume 37 Advanced structured materials ; v. 37. |
Subject: | Solder and soldering. Welded joints -- Reliability. TECHNOLOGY & ENGINEERING -- Technical & Manufacturing Industries & Trades. Chimie. Science des matériaux. Solder and soldering. Electronic books. |
Format: | E-Resource Book |
URL for this record: | http://pi.lib.uchicago.edu/1001/cat/bib/11084785 |
Table of Contents:
- Overview of the Simulation Methodology
- Requirements for Finite Element Simulation
- Mechanics of Solder Materials
- Application I: Solder Joint Reflow Process
- Application II: Solder Joints under Temperature and Mechanical Cycles
- Damage Mechanics-based Models
- Application III: Board-level Drop Test with BGA Package
- Fatigue Fracture Process of Solder Joints
- Closure.