Solder joint reliability assessment : finite element simulation methodology /

This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder jointsubjected to reliability test conditions are elaborated. These cover...

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Bibliographic Details
Author / Creator:Tamin, Mohd N., author.
Imprint:Cham : Springer, 2014.
Description:1 online resource.
Language:English
Series:Advanced structured materials ; volume 37
Advanced structured materials ; v. 37.
Subject:Solder and soldering.
Welded joints -- Reliability.
TECHNOLOGY & ENGINEERING -- Technical & Manufacturing Industries & Trades.
Chimie.
Science des matériaux.
Solder and soldering.
Electronic books.
Format: E-Resource Book
URL for this record:http://pi.lib.uchicago.edu/1001/cat/bib/11084785
Hidden Bibliographic Details
Other authors / contributors:Shaffiar, Norhashimah M., author.
ISBN:9783319000923
3319000926
3319000918
9783319000916
9783319000916
Notes:Print version record.
Summary:This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder jointsubjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.
Other form:Print version: Tamin, Mohd N. Solder joint reliability assessment 9783319000916
Standard no.:10.1007/978-3-319-00092-3
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505 0 |a Overview of the Simulation Methodology -- Requirements for Finite Element Simulation -- Mechanics of Solder Materials -- Application I: Solder Joint Reflow Process -- Application II: Solder Joints under Temperature and Mechanical Cycles -- Damage Mechanics-based Models -- Application III: Board-level Drop Test with BGA Package -- Fatigue Fracture Process of Solder Joints -- Closure. 
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