High-bandwidth memory interface /

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Bibliographic Details
Author / Creator:Kim, Chulwoo, author.
Imprint:New York : Springer, 2014.
Description:1 online resource (viii, 88 pages) : illustrations (some color).
Language:English
Series:SpringerBriefs in Electrical and Computer Engineering, 2191-8112
SpringerBriefs in electrical and computer engineering,
Subject:
Format: E-Resource Book
URL for this record:http://pi.lib.uchicago.edu/1001/cat/bib/11081870
Hidden Bibliographic Details
Other authors / contributors:Lee, Hyun-Woo, author.
Song, Junyoung, author.
ISBN:9783319023816
3319023810
1306200024
9781306200028
3319023802
9783319023809
9783319023809
Notes:Includes bibliographical references and index.
Online resource; title from PDF title page (SpringerLink, viewed October 28, 2013).
Summary:This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered. Enables readers with minimal background in memory design to understand the basics of high-bandwidth memory interface design; Presents state-of-the-art techniques for memory interface design; Covers memory interface design at both the circuit level and system architecture level.
Standard no.:10.1007/978-3-319-02381-6